Application Engineer - Bonder (m/f/d)

Große Ideen beginnen oft klein – manchmal kleiner als ein Staubkorn. Mikrochips sind die treibende Kraft hinter den Werkzeugen und Geräten, auf die wir uns täglich verlassen. Wir ermöglichen ihre Herstellung durch skalierbare, hochpräzise Lösungen in Lithografie, Wafer-Bonding und Packaging. Mit über 75 Jahren Erfahrung und weltweiter Präsenz sind wir ein vertrauenswürdiger Partner, der Verlässlichkeit und Innovationskraft verbindet.

Dabei leitet uns die Überzeugung, dass Innovation nicht nur durch Technologie entsteht, sondern durch Menschen, die Verantwortung übernehmen und gemeinsam Grenzen überwinden.

Do you work in a structured manner, are you reliable and ensure that our customers always receive the best possible support? Then join our team! In this position, you will be responsible for looking after and supporting our customers, providing training and ensuring that our machines and processes fulfil the high expectations of the Semiconductor Industry - all in a high-precision environment that also includes working in clean rooms.

At the earliest possible date we are looking for

Application Engineer - Bonder (m/f/d) Onsite position – Zhubei (Taiyuan)/Taichung, Taiwan (local employment)

• Hsinchu (Taiyuan), Taichung
• Vollzeit
• unbefristet

Ihre Aufgaben

• Lead and drive the qualification, process development, trouble-shooting, characterization of advanced chip/wafer bonding/de-bonding processes for SUSS products to ensure competitive edge of processes performance for customer demands in the domain fields of 3D advanced semiconductor, e.g. SoIC, CoWoS, InFO, BSPDN
• Improve the yield of process characteristics by analyzing process symptom data and performing for expertise documentation of technique to conduct 3D processes enhancement for sophisticated technical projects and events
• Act as the primary point of contact for on field key customers, manage multi-disciplinary projects and technical tasks of R&D or HVM from concept to completion, ensuring milestones on time and within planning scope
• Co-worker with the team to cultivate the continuous BKM techniques knowledge stewardship, accelerating the team's technical proficiency
• Take accountability and ownership of critical tasks and projects assigned by supervisor

Ihr Profil

• Education of Master or beyond in engineering background for Physics, Optics, Material Science, Mechanical Engineering, Electrical Engineering
• 8+ years of proven experience in wafer fab working, specifically in 3D wafer process engineering or field applications
• Deep technical proficiency with chip/wafer bonder/de-bonder and sophistic knowledge with 3D semiconductor or advanced packaging domains
• Demonstrated experience in managing complex projects or tasks
• Analytical skills, self-motivated, resilience characteristics with good accountability

Wir bieten unter anderem

• TW_We enrich your life with attractive rewards
• TW_Working hours that accommodate your individual needs
• TW_Working together and celebrating together
• TW_Your health is important to us

Sie interessieren sich für diese Stelle? Dann bewerben Sie sich jetzt.

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