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Technical Business Development Specialist (m/f/d)

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Onsite

Technical Business Development Specialist (m/f/d)

SUSS

Technical Business Development Specialist (m/f/d)

Skills

Product StrategyRBusiness Development

14 days ago

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Important information


Contract type:

Permanent

Location:

Taiwan

Work mode:

Onsite

Published on:

12 October 2026

What they need


Große Ideen beginnen oft klein – manchmal kleiner als ein Staubkorn. Mikrochips sind die treibende Kraft hinter den Werkzeugen und Geräten, auf die wir uns täglich verlassen. Wir ermöglichen ihre Herstellung durch skalierbare, hochpräzise Lösungen in Lithografie, Wafer-Bonding und Packaging. Mit über 75 Jahren Erfahrung und weltweiter Präsenz sind wir ein vertrauenswürdiger Partner, der Verlässlichkeit und Innovationskraft verbindet.

Dabei leitet uns die Überzeugung, dass Innovation nicht nur durch Technologie entsteht, sondern durch Menschen, die Verantwortung übernehmen und gemeinsam Grenzen überwinden.

Do you think strategically, are you interested in the dynamic market of the Semiconductor Industry and promote the success of innovative technologies? Take responsibility for the success of our products and solutions, develop sustainable strategies and promote innovative technologies in a promising market.

We are looking for the next possible date

Technical Business Development Specialist (m/f/d) Onsite position – Zhubei (Taiyuan), Taiwan (local employment)

  • Hsinchu (Taiyuan)
  • Vollzeit
  • unbefristet

Ihre Aufgaben

  • Technology Scouting & Market Intelligence

  • Monitor industry trends and emerging technologies in semiconductor manufacturing and advanced packaging.

  • Identify future equipment opportunities related to:

  • Hybrid Bonding

  • Wafer-to-Wafer Bonding

  • Die-to-Wafer Bonding

  • Temporary Bonding & Debonding

  • Advanced Packaging Lithography

  • RDL Processing

  • Heterogeneous Integration

  • Chiplet Integration

  • Silicon Photonics

  • Co-Packaged Optics (CPO)

  • Glass Core Packaging

  • HBM Packaging Technologies

  • Analyze competitive technology developments and provide strategic recommendations.

  • Strategic Customer Engagement

  • Establish and maintain technical relationships with key customer engineering and technology organizations.

  • Support technical discussions with process integration, module engineering, R&D and advanced packaging teams.

  • Participate in customer technology reviews, workshops and roadmap discussions.

  • Serve as a trusted technical advisor to strategic customers.

  • Product & Technology Strategy

  • Translate customer technology requirements into actionable product development recommendations.

  • Support long-term product roadmap planning for:

  • Wafer Bonding Systems

  • Temporary Bonding & Debonding Platforms

  • Hybrid Bonding Solutions

  • Advanced Packaging Lithography Systems

  • Large Field Exposure Technologies

  • Identify technology gaps and future investment opportunities.

  • Competitive Intelligence

  • Monitor competitive activities, product launches and technology roadmaps.

  • Benchmark competitor solutions and identify differentiation opportunities.

  • Deliver regular market and technology assessment reports.

  • Business Development Support

  • Support strategic account planning and opportunity development.

  • Prepare technical presentations, technology assessments and business case evaluations.

  • Support major customer pursuits and technology evaluations.

  • Industry Engagement

  • Represent the company at major industry conferences and technical forums.

  • Build relationships with semiconductor research institutes, industry organizations and ecosystem partners.

  • Maintain awareness of emerging technology developments across the semiconductor industry.

Ihr Profil Education

  • Master’s degree or Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, Semiconductor Engineering or related disciplines.

Experience Required:

  • Minimum 15 years of semiconductor industry experience.

  • Minimum 10 years of experience in one or more of the following areas:

  • Advanced Packaging

  • Wafer Bonding

  • Hybrid Bonding

  • Lithography

  • Process Integration

  • Semiconductor Equipment Development

Preferred:

  • Experience with leading semiconductor manufacturers, OSATs or semiconductor equipment suppliers.
  • Experience interacting with senior technical leadership and executive management.

Personal Attributes

  • Strong technical leadership and influence skills.
  • Excellent communication and presentation capabilities.
  • Ability to engage with both technical and executive audiences.
  • Self-driven and comfortable operating in a highly dynamic environment.
  • Willingness to travel internationally.

Wir bieten unter anderem

  • TW_We enrich your life with attractive rewards
  • TW_Working hours that accommodate your individual needs
  • TW_Working together and celebrating together
  • TW_Your health is important to us

Sie interessieren sich für diese Stelle? Dann bewerben Sie sich jetzt.

Ihr Recruiting-Team Explorative Zusendungen von Bewerbungsprofilen über Drittanbieter, ohne HR-Auftragsersuch, werden nicht akzeptiert.

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