鸿富锦精密工业(深圳)有限公司
产品失效分析及测试工程师-2
1 month ago
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Important information
Contract type:
Permanent
Location:
Wuhan, Hubei, China
Work mode:
Onsite
Published on:
11 September 2026
What they need
该职位来源于猎聘 【工作经历】 1.具备5年以上BGA Rework及PCBA维修经验 2.熟悉BGA、QFN、LGA拆装、返修作业 3.负责Server主板故障分析、IC更换及板级维修，提升产品良率 4.熟练操作卓茂/SRT等BGA Rework设备，具Profile制作能力 5.具备SOP制定、机台保养维护、新人培训及技术指导经验 【技能要求】 1.具备5年以上BGA Rework工作经验 2.熟悉Server主板维修及电子电路分析 3.熟练操作卓茂BGA返修台、SRT、X-Ray及显微镜 4.具备BGA植球、焊接、IC更换及高密度封装返修能力 5.具备良率改善、异常分析及制程优化能力，可配合海外出差
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