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2027 Campus_Physical Design Engineer

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Onsite

2027 Campus_Physical Design Engineer

MediaTek

2027 Campus_Physical Design Engineer

2 months ago

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Important information


Contract type:

Permanent

Location:

Hsinchu, North District, Hsinchu City, Taiwan

Work mode:

Onsite

Published on:

4 September 2026

What they need


We’re Looking for You! (Each applicant may apply for up to five positions in the 2027 Campus Recruitment Program.) If you are a 2027 Master’s or Ph.D. graduate with a background in Electrical Engineering, Electronics, Computer Science, Computer Engineering, Information Management, Telecommunications, Communications, Control Engineering, or other related fields, and are passionate about chip design, AI computing, wireless communications, smart devices, and multimedia technologies, we invite you to join MediaTek. We are looking for individuals who are eager to learn, embrace challenges, communicate ideas openly, collaborate effectively, and continuously seek better solutions through innovation and teamwork. At MediaTek, you will work alongside world-class talent to develop industry-leading semiconductor technologies and transform innovative ideas into products that make a global impact.

Main Requirements and Qualifications

  • 1.Coursework in VLSI Design, Physical Design, ASIC Design, or EDA.
  • 2.Experience with EDA tools such as Innovus, ICC2, PrimeTime, or Calibre.
  • 3.Project, research, or internship experience related to physical implementation or timing optimization.
  • 4.Familiarity with DRC, LVS, IR Drop, or EM analysis.
  • 5.Good English reading and technical documentation skills.

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