MediaTek
2027 Campus_Wireless Connectivity Engineer
Skills
2 months ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
4 September 2026
What they need
We’re Looking for You! (Each applicant may apply for up to five positions in the 2027 Campus Recruitment Program.) If you are a 2027 Master’s or Ph.D. graduate with a background in Electrical Engineering, Electronics, Computer Science, Computer Engineering, Information Management, Telecommunications, Communications, Control Engineering, or other related fields, and are passionate about chip design, AI computing, wireless communications, smart devices, and multimedia technologies, we invite you to join MediaTek. We are looking for individuals who are eager to learn, embrace challenges, communicate ideas openly, collaborate effectively, and continuously seek better solutions through innovation and teamwork. At MediaTek, you will work alongside world-class talent to develop industry-leading semiconductor technologies and transform innovative ideas into products that make a global impact.
Main Requirements and Qualifications
- 1.Coursework in Wireless Communications, Computer Networks, Communication Systems, or Embedded Systems.
- 2.Familiarity with IEEE 802.11 (Wi-Fi), Bluetooth, GNSS, UWB, or NFC protocols.
- 3.Project, research, or internship experience in wireless connectivity, networking, driver development, or connectivity validation.
- 4.Experience with Python, Shell Script, Wireshark, or network analysis tools.
- 5.Good English reading and technical documentation skills.
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