进迭时空（杭州）科技有限公司
（2027秋招）封装工程师
24 days ago
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Important information
Contract type:
Permanent
Salary:
CN¥180,000 – CN¥360,000 / year
Location:
Shanghai, China
Work mode:
Onsite
Published on:
2 October 2026
What they need
该职位来源于猎聘 职位描述： 1. 根据项目研发需求，负责封装方案设计和开发，并从性能、成本、量产工艺条件等角度提供有竞争力的系统级封装解决方案； 2. 独立完成封装基板设计、ballmap规划、fanout等工作，熟练使用封装设计EDA工具，输出相关封装图纸； 3. 跟进封装NRE导入、测试、验证等流程，负责封装相关问题定位、分析和优化，解决研发及量产过程中的封装等问题； 职位要求： 1. 半导体电子专业，电气工程专业或其他相关本科以上学历；
- 较强的逻辑思考能力、分析问题能力、沟通能力、自主学习能力和团队合作以及创新意识； 3. 能够熟练阅读英文技术文档；
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