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【2027校招】数字IC后端工程师-厦门

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【2027校招】数字IC后端工程师-厦门

星宸科技股份有限公司

【2027校招】数字IC后端工程师-厦门

2 months ago

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Important information


Contract type:

Permanent

Location:

Xiamen, Fujian, China

Work mode:

Onsite

Published on:

17 August 2026

What they need


该职位来源于猎聘 1.参与系统方案的时钟、复位、电源的布局规划;

  • 负责从Netlist到GDSII的物理设计,包括布局布线、形式验证、静态时序分析、物理验证、功耗分析、串扰分析、电源完整性分析等工作;
  • 与STA工程师配合实现芯片时序收敛,完成时序Signoff;
  • 对全芯片物理验证(DRC/LVS)负责。 任职资格: 1.本科以上学历,电子类相关专业毕业;
  • 数字、模拟电路基础扎实,熟悉主流的数字集成电路实现EDA工具者佳;
  • 爱思考和钻研,学习能力强;
  • 工作勤奋,乐于团队合作和分享。 有以下经验者优先: 1.熟悉数字后端ICC2/Innovus等实现工具; 2.有SOC芯片数字后端Tapeout经验。 薪资仅供参考,具体以面议为主。

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