芯联集成电路(上海)有限公司
研发工艺整合工程师（2027届）(J10876)
2 months ago
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Important information
Contract type:
Permanent
Location:
Shaoxing, Zhejiang, China
Work mode:
Onsite
Published on:
9 August 2026
What they need
该职位来源于猎聘 职责描述： 1. 对外联接客户，对内协调整合各技术部门资源，负责新产品的立项、开发、量产整个过程； 2. 了解芯片的应用需求，将信息反馈给工厂进行执行及产出，与module工程师合作完善工艺流程； 3.工艺制造流程建立、技术开发及制程整合改善与日常维护等相关工作； 4. 良率提升与品质改善； 5. WAT/CP电性分析及产品失效分析等。" 任职要求： 1.学历：硕士及以上 2.专业：微电子/电子科学/材料/物理等相关理工科专业 3. 具备较强的逻辑分析能力、协调和执行能力 4. 具备较强的团队合作精神和抗压能力 5. 具备良好的英文听说读写能力"
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