捷普科技(上海)有限公司
2.5D硅桥研发工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Beijing, China
Work mode:
Onsite
Published on:
16 August 2026
What they need
该职位来源于猎聘 一、岗位说明：
2.5D硅桥工艺研发，负责设计实验(DOE)，操作手动机台及实验室设备进行打样，取得实验数据，分析实验结果及原理,制定工艺路线及工艺窗口。 二、任职要求： 1.具有2.5D及相关研发经验，具有半导体封装工艺设备及材料的知识,能力及经验，特别是 TCB相关经验，临时键合/解键合及各种键合材料相关经验。 2.具有团队合作能力及团队管理能力。 三、录用优先条件：TCB/临时键合/解键合及各种键合材料相关经验，项目管理
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