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27校招-硬件工程师(成都) (MJ002184)

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27校招-硬件工程师(成都) (MJ002184)

北京东土科技股份有限公司

27校招-硬件工程师(成都) (MJ002184)

4 months ago

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Important information


Contract type:

Permanent

Location:

Chengdu, Sichuan, China

Work mode:

Onsite

Published on:

7 August 2026

What they need


该职位来源于猎聘 岗位职责: 设计开发工业控制系统硬件模块及电路原理图; 实施PCB布局布线及关键信号完整性分析; 维护测试仪器设备功能并优化调试流程; 评估电子元器件选型方案与成本控制; 配合生产部门推动硬件产品测试验证; 分析产品故障数据并输出诊断报告; 配合软件开发人员完成硬件联调任务。 职位要求: 通信工程/电子信息工程/自动化等相关学科本科及以上学历; 掌握数字电路设计原理,熟悉ARM/DSP体系结构; 具备示波器、逻辑分析仪等仪器操作能力; 理解PCB设计规范及EMC相关测试标准; 熟练使用Altium Designer等EDA工具; 良好的英文技术文档阅读能力; 具备团队协作意识与跨部门沟通技能。

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