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MediaTek
Advanced Package Engineer/ Technical Manager
18 days ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
2 October 2026
What they need
- CoWoS and 2.5D package technology development 2. 3D package technology development 3. CPC/CPO package technology development 4. Mobile/WiFi/TV/Automotive package development 5. Package technology integration and NTO handle 6. Package design/SIPI/Layout 7. Package Modeling
Main Requirements and Qualifications
- Advanced package technology, design, modeling, including but not limited to CoWoS/2.5D/3D/CPC/CPO
- Package technology integration and NTO handle experience
- Packaging experience >6 years
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