Infineon Technologies (Malaysia) Sdn Bhd
Advanced Packaging & Engineering Opportunities | Multiple Functions
Skills
2 months ago
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Important information
Contract type:
Permanent
Location:
Malacca, Malaysia
Work mode:
Onsite
Published on:
28 August 2026
What they need
Shape the Future of Technology with Us
Are you passionate about advancing AI, high-performance computing, automotive innovation, and next-generation semiconductor technologies?
Join an industry-leading team driving breakthroughs in advanced semiconductor packaging, substrate design, technology integration, and unit process development. We are expanding our engineering organization and seeking talented professionals who are ready to innovate, collaborate, and make a lasting impact.
Whether you are an experienced engineer looking for your next challenge or a technology expert eager to contribute to cutting-edge solutions, we invite you to explore our opportunities.
Available Opportunities :
Advanced Packaging & Package Technology
- Principal Engineer and Senior Staff Engineer Package Technology
- Senior Staff Engineer, Package Definition
Unit Process Development (UPD)
Principal Engineer :
- Pre Assembly
- Singulation
- Dispensing & Jetting
Senior Staff Engineer :
- SMT
- SMT Printing
- Die Attach, Flip Chip
- Wire Bond
- End Of Line ( Mold, Plating, Deflashing and Singulation )
Technology Integration & Excellence
- Senior Staff Engineer Technology Integration
- Principal Engineer, Technology Excellence
Design & Development
- Senior Staff Engineer, Substrate Designer
Project Management
- Project Manager Project Management
- Senior Project Manager, Project Management
- Director, Project Management
What We're Looking For
We are seeking professionals who are:
✅ Passionate about engineering, technology, and innovation
✅ Eager to learn, grow, and continuously develop their expertise
✅ Committed to delivering advanced semiconductor solutions
✅ Strong team players who thrive in a collaborative, global environment
✅ Ready to contribute to technologies that power the future
Why Join Us?
- Work on cutting-edge semiconductor and advanced packaging technologies
- Collaborate with global technology and engineering teams
- Opportunities for career growth and professional development
- Be part of projects shaping AI, automotive, and intelligent edge applications
- Dynamic, innovative, and inclusive work environment
Apply Today
Take the next step in your career and join a team that is shaping the future of semiconductor technology.
Submit your resume today and indicate the position(s) you are interested in.
We look forward to connecting with talented professionals who are ready to innovate and grow with us.
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