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Advanced Packaging & Engineering Opportunities | Multiple Functions

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Onsite

Advanced Packaging & Engineering Opportunities | Multiple Functions

Infineon Technologies (Malaysia) Sdn Bhd

Advanced Packaging & Engineering Opportunities | Multiple Functions

Skills

AI

2 months ago

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Important information


Contract type:

Permanent

Location:

Malacca, Malaysia

Work mode:

Onsite

Published on:

28 August 2026

What they need


Shape the Future of Technology with Us

Are you passionate about advancing AI, high-performance computing, automotive innovation, and next-generation semiconductor technologies?

Join an industry-leading team driving breakthroughs in advanced semiconductor packaging, substrate design, technology integration, and unit process development. We are expanding our engineering organization and seeking talented professionals who are ready to innovate, collaborate, and make a lasting impact.

Whether you are an experienced engineer looking for your next challenge or a technology expert eager to contribute to cutting-edge solutions, we invite you to explore our opportunities.

Available Opportunities :

Advanced Packaging & Package Technology

  • Principal Engineer and Senior Staff Engineer Package Technology
  • Senior Staff Engineer, Package Definition

Unit Process Development (UPD)

Principal Engineer :

  • Pre Assembly
  • Singulation
  • Dispensing & Jetting

Senior Staff Engineer :

  • SMT
  • SMT Printing
  • Die Attach, Flip Chip
  • Wire Bond
  • End Of Line ( Mold, Plating, Deflashing and Singulation )

Technology Integration & Excellence

  • Senior Staff Engineer Technology Integration
  • Principal Engineer, Technology Excellence

Design & Development

  • Senior Staff Engineer, Substrate Designer

Project Management

  • Project Manager Project Management
  • Senior Project Manager, Project Management
  • Director, Project Management

What We're Looking For

We are seeking professionals who are:

✅ Passionate about engineering, technology, and innovation

✅ Eager to learn, grow, and continuously develop their expertise

✅ Committed to delivering advanced semiconductor solutions

✅ Strong team players who thrive in a collaborative, global environment

✅ Ready to contribute to technologies that power the future

Why Join Us?

  • Work on cutting-edge semiconductor and advanced packaging technologies
  • Collaborate with global technology and engineering teams
  • Opportunities for career growth and professional development
  • Be part of projects shaping AI, automotive, and intelligent edge applications
  • Dynamic, innovative, and inclusive work environment

Apply Today

Take the next step in your career and join a team that is shaping the future of semiconductor technology.

Submit your resume today and indicate the position(s) you are interested in.

We look forward to connecting with talented professionals who are ready to innovate and grow with us.

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