Advanced Packaging & Heterogeneous Integration Engineer

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Advanced Packaging & Heterogeneous Integration Engineer

Why this work matters

Touchdown is engineering modular manufacturing for the chips and memory systems future computing needs. This role helps turn a buyer's physical result into a qualified process or a defensible decision to use an existing supplier. Advanced packaging is our intended first fab class; no production fab is operating today.

Overview You will translate a real device and system requirement into a package that can be assembled, measured, and qualified. Compare available substrate, interposer, attach, bonding, thermal, and test routes before proposing an owned step. Make incoming die quality, interfaces, warpage, power delivery, signal behavior, reliability, and rework explicit. The first goal is a defensible qualification plan, not a claim that a packaging line already exists.

What you will own

• Define known-good-die intake, package stack, assembly, integration, thermal/electrical tests, and rework limits.
• Translate a customer device and system requirement into package architecture and CTQs.
• Compare substrates, interposers, attach, thermal paths, and available assembly partners.
• Define incoming-die criteria, package test, reliability stress, and failure disposition.
• Define interface and acceptance responsibilities among die supplier, assembly partner, test owner, and receiving customer.
• Use simulations and measured package samples to separate design margin from process variation and assembly defects.

Technical territory

2.5D and 3D package options; chiplets and known-good die; substrates, interposers, redistribution layers, die attach and bonding; electrical and thermal paths; warpage, underfill, inspection, reliability stress, assembly yield, and test coverage.

Representative outputs

• A package qualification plan from incoming die through assembly, test, reliability, and failure disposition.
• A package stack and interface drawing with material, tolerance, and known-good-die assumptions.
• An assembly and qualification matrix tied to customer use conditions.
• A build-and-test traveler with incoming criteria, inspection points, reliability stresses, reject rules, and supplier handoffs.

What success looks like

• Package acceptance is measurable from incoming die to final test.
• The selected route beats or clearly fails against a partner baseline.
• The package route satisfies the customer's electrical, thermal, mechanical, and reliability limits on reviewable evidence.
• The team can compare partner assembly with an owned process on yield, cycle time, cost, and control.

What you bring

• Advanced packaging, substrate/interposer, die attach or bonding, and product qualification.
• Shipped or qualified an advanced package, module, or heterogeneous assembly.
• Can reason about thermal, electrical, mechanical, and manufacturability tradeoffs.
• Can work with substrate, assembly, test, and customer engineering teams.
• Ability to connect package architecture to assembly capability, inspection, test, and reliability evidence.
• Experience diagnosing package defects or failures with cross-sectional, electrical, mechanical, or thermal measurements.

Helpful experience

• Chiplets, 2.5D/3D integration, or advanced substrates
• Thermomechanical modeling and package reliability
• High-density interconnects and power delivery
• Assembly yield and test coverage
• Supplier qualification and package transfer

How the role works

• Applications are open; the exact work location, arrangement, compensation, and start date will be discussed during hiring.
• Early work can produce engineering plans and partner comparisons. Hands-on work begins only at qualified, authorized facilities.
• You will work with process, equipment, quality, test, customer, and supplier owners as the scope requires.

Apply for this role →

Show a real process, tool, workpiece, or product decision you owned, the measurements behind it, and what another team could reproduce.