Advanced Packaging & Process Integration Engineer – Leading R&D Organization

Our client is a

well-established research and technology organisation

, focusing on advanced R&D and the development of next-generation semiconductor technologies.

We are looking for an

Advanced Packaging & Process Integration Engineer

to support the research and development of advanced semiconductor packaging and heterogeneous integration technologies.

Position:
Advanced Packaging & Process Integration Engineer

Employment Type:
Full Time, Permanent

Location:
Singapore

Responsibilities:
Research and develop

fine-pitch flip-chip and hybrid bonding

technologies

Develop

Chip-to-Wafer and Wafer-to-Wafer

bonding processes

Support interposer and hybrid bond pad fabrication and process integration

Optimise bonding materials, surface preparation and process parameters

Conduct engineering experiments, process optimisation and data analysis

Improve process yield, performance and reliability

Support

2.5D / 3D heterogeneous integration

technology development

Collaborate with internal teams and external partners on R&D projects

Requirements:
Bachelor’s Degree in

Materials, Mechanical, Chemical, Electronics, Electrical, Computer Engineering

or related discipline

1–6 years

of relevant experience in microelectronics, semiconductor or component integration

Experience in

advanced packaging / process integration

is preferred

Hands-on experience in

flip-chip bonding

will be advantageous

Knowledge of

hybrid bonding equipment and materials

is advantageous

Experience in process development, data analysis and

DOE

preferred

Good analytical, problem-solving and communication skills

**Interested candidates, kindly email updated resume to

[email protected]

with Subject of "Advanced Packaging & Process Integration Engineer", thank you.

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