Advanced Packaging Process Integration Engineer

岗位概述：

作为河套先进封装团队的核心工艺整合成员，配合项目经理，负责新产品从研发到样品的工艺整合与流程开发，统筹各工艺模块的衔接与优化，打通"研发样品→可量产工艺"的关键环节。

Position Overview:

As a core process integration engineer of the Hetao Advanced Packaging Team, you will work closely with project managers to lead the process integration and flow development of new products — from R&D to sample stage, coordinating and optimizing the interfaces between process modules to bridge the critical gap from "R&D samples" to "mass-producible processes."

岗位职责：

1. 承接研发阶段产品，主导工艺整合方案设计与整体工艺流程（Process Flow）搭建，完成可制造性评估（DFM）与工艺可行性分析；
2. 统筹协调各工艺模块，解决模块间兼容性、界面衔接与工艺交互问题；针对柔性/传感器类产品，整合柔性基材上的整套工艺制程，主导翘曲、对准、良率等系统性工艺难题的攻关；
3. 建立并维护工艺整合文档（整体工艺流程图、控制计划、FMEA、工艺规格书等），制定关键工艺窗口与参数规范，推动工艺参数优化与固化；
4. 跟进样品试制全过程，主导工艺异常的系统性分析与失效定位，推动样品按期交付并持续提升良率；
5. 与研发、生产、质量等部门协同，牵头新工艺、新材料导入中的整合验证与工艺成熟度评估，推动产品可量产化。

Key Responsibilities:

1. Take ownership of R&D-stage products, lead the design of process integration solutions and the construction of overall process flows, and complete Design for Manufacturing (DFM) assessments and process feasibility analysis;
2. Coordinate all process modules， resolving compatibility, interface, and process-interaction issues across modules;
3. Establish and maintain process integration documentation (overall process flow charts, control plans, FMEA, process specifications, etc.), define key process windows and parameter standards, and drive process parameter optimization and freezing;
4. Follow up on the entire sample trial production process, lead systematic analysis and failure localization of process anomalies, ensure on-time sample delivery, and continuously improve yield;
5. Collaborate with R&D, manufacturing, and quality departments, take the lead in integration qualification and process maturity assessment for new processes and materials, and drive products toward mass production readiness.

任职要求：

1. 本科及以上学历，微电子、材料科学与工程、机械、物理、化学等相关专业；
2. 2年以上半导体封装或先进封装工艺整合经验（硕士学历可适当放宽）；
3. 熟悉先进封装全流程工艺，至少精通 1~2 类核心工艺模块，有晶圆级封装、玻璃基板或柔性器件工艺整合经验者优先；
4. 掌握 DFM、FMEA、SPC、DOE 等工程方法，具备跨模块的系统性问题分析与良率提升能力；
5. 具备良好的项目配合意识与跨部门沟通协调能力，能高效支撑项目经理推进节点；
6. 具备英文读写能力，粤语为加分项。

Qualifications:

1. Bachelor's degree or above in microelectronics, materials science and engineering, mechanical engineering, physics, chemistry, or related fields;
2. 2+ years of experience in semiconductor packaging or advanced packaging process integration (may be relaxed for master's degree holders);
3. Familiar with the full advanced packaging process flow, with deep expertise in at least 1–2 core process modules; Experience in wafer-level packaging, glass substrate, or flexible device process integration is preferred;
4. Proficient in engineering methodologies such as DFM, FMEA, SPC, and DOE, with cross-module systematic problem-analysis and yield-improvement capabilities;
5. Strong sense of collaboration and cross-departmental communication and coordination skills, capable of effectively supporting project managers in meeting milestones;
6. English reading and writing proficiency; Cantonese is a plus.