Advanced Packaging – Process Technician

Job Title Advanced Packaging – Process Technician

Job Description Avicena is a privately held company developing microLED based ultra-low power high bandwidth interconnects for chip-to-chip communications. This technology will revolutionize High-Performance (HPC) and Cloud computing, as well as other industries where low power interconnects are critical like camera sensors, autonomous vehicles, and aerospace. Avicena is headquartered in Sunnyvale, California with a development center in Edinburgh, Scotland. The company was founded in 2019 by leading technologists from the optical networking industry with a track record of delivering breakthrough products. (www.avicena.tech)

About The Role

• As a process technician in our clean room, your responsibilities may include being responsible for performing technical tests and experiments for engineering in the wafer fabrication area of semiconductor manufacturers.
• Process technicians also test new products and provide technical assistance to process development and engineering personnel.
• This technician will be a valuable part of the team, interfacing and communicating with engineering and manufacturing groups across the fab to ensure all issues are solved appropriately and efficiently.
• Additionally, you will provide process and product support to the organization and address production concerns and disposition of production material.

Responsibilities

• Ability to identify, multi-task, and resolve multiple priority issues quickly and efficiently to improve overall fab performance.
• Ability to learn and understand process flow quickly and support the engineering organization as needed.
• Exceptional attention to detail
• Strong collaborative skills in team environment
• Excellent verbal and written communications skills.
• Perform other designated tasks as assigned by management.
• Comfortable in a clean room environment.
• Proficient with MS Office, Word and Excel

Qualifications

• AA degree or 4 years of experience in a cleanroom fab is preferred.
• Experience with Flip Chip Bonding, flux dispense, underfill dispense, profilometry, optical microscope inspection and related operations.
• Familiar with probe station and experience of electrical test is a plus.
• Preferred: Experience with operating lasers and its related safety protocols.