MediaTek
Advanced packaging technology development engineer/ manager
2 months ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
14 August 2026
What they need
- Advanced new product introduction technology development (new product trial production planning, DRC inspection, DOE and yield improvement planning, mass production interval and yield analysis) 2. Familiar with advanced chiplet and 3DIC packaging technology development 3. Advanced packaging structure design at wafer level and panel level
Main Requirements and Qualifications
- Have practical experience in Layout/process/reliability
- Simulation analysis of mechanical properties and thermal properties
- Experience in large packaging and memory development
- Development experience in common optical packaging technology
- PI/SI application analysis experience
- More than 8 years of working experience in foundry or related advanced packaging
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