M
MediaTek
Advanced Substrate/PCB technology Expert
2 months ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
19 August 2026
What they need
- New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops 2. 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development 3. Common strip format unification management 4. Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT ) 5. PCB technology development and DRM owner
Main Requirements and Qualifications
- New SBT vendor bring up , New SBT vendor YIP , troubleshooting and Ops
- 3D, 3.5D & e-IVR Technology Enabling, CPC/CPO technology building block development
- Common strip format unification management
- Advanced PCB Ultra-Large size. I.e., CoWoP, DCAI PCB w/ high layer counts (PCB vendor ISU, GCE, UMTC, VGT )
- PCB technology development and DRM owner
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