AI Server/Rack system Lead manager

Company Overview:

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 233 campuses across 24 countries. In the US, Foxconn employs 8,000 across 56 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2025, Foxconn ranks 28th among the Fortune Global 500 and reported revenue of approximately USD $259 billion.

The company’s diverse product offerings span four major segments: smart consumer electronics, cloud, and networking solutions, computing, and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together, these initiatives position the company as a leader in innovation for the 21st century.

Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods.

Job Summary:

The AI Server/Rack System Lead Manager leads a multidisciplinary engineering team across System, Electrical, Power, and Mechanical Engineering to ensure multi-million-dollar AI hardware clusters are transformed from integrated racks into fully configured, stable, high-quality systems ready for deployment at hyperscale data centers. This role provides technical leadership across system integration, manufacturing execution, quality, customer requirements, and production readiness.

Duties and Responsibilities:

• Lead System, Electrical, Power, and Mechanical Engineering teams in resolving complex production and system-level issues. Serve as the primary technical escalation point for critical issues on the manufacturing floor and drive timely resolution.Lead System, Electrical, Power, and Mechanical Engineering teams in resolving complex production and system-level issues. Serve as the primary technical escalation point for critical issues on the manufacturing floor and drive timely resolution.
• Drive improvements in factory yield, cycle time, system quality, and production efficiency for AI server/rack systems. Establish engineering quality standards and use data-driven analysis to identify and eliminate recurring production issues.
• Work directly with hyperscale’s and key customers to align system requirements, validation criteria, and deployment expectations. Lead technical readiness reviews and provide engineering support for customer release and system sign-off.
• Manage engineering changes and ensure manufacturing feedback is incorporated into system and product improvements. Establish effective feedback loops between R&D, manufacturing, quality, and customer teams to improve product performance and reliability.
• Ensure engineering and manufacturing activities comply with high-voltage, mechanical, and workplace safety requirements. Promote safe engineering practices and enforce applicable U.S. regulatory and company safety standards.

Education:

• Bachelor of Science (BS) degree in Electrical Engineering, Computer Engineering, Systems Engineering, Mechanical Engineering, Manufacturing Engineering, or a closely related field is required.

Experience:

• 4–7+ years of experience in enterprise server, rack infrastructure, or AI cluster system engineering, with strong knowledge of full-stack AI cluster architecture, high-speed network topologies, and advanced infrastructure limitations.
• 3–5 years of experience leading multidisciplinary engineering teams, managing personnel, allocating resources, and resolving complex technical issues in fast-paced production environments.
• 2+ years of experience integrating high-density power and liquid cooling infrastructure, with the ability to understand system-level electrical, thermal, mechanical, and performance requirement2+ years of experience integrating high-density power and liquid cooling infrastructure, with the ability to understand system-level electrical, thermal, mechanical, and performance requirement.
• 3+ years of experience in manufacturing operations, yield analysis, cycle-time optimization, and quality frameworks, with demonstrated ability to drive root-cause analysis and continuous improvement.
• 2+ years of experience enforcing U.S. industrial safety requirements, with knowledge of applicable regulatory standards, high-voltage safety, mechanical safety, and the ability to lead technical decisions under pressure.

EEOC Statement

Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.