日月新半导体有限公司
资深电镀&湿法工艺工程师（bumping)
2 months ago
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Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
4 September 2026
What they need
该职位来源于猎聘 工作内容： 1.Cu pillar bumping plating/etching/ball mount/reflow站点工艺维护及良率提升 2.电镀液建槽/浓度分析/镀液添加等管理 3.验证新材料可行性，收集DOE 数据并完成分析工作 4.新工艺路线及制程开发 5.对电镀蚀刻区设备工艺稳定维护、效率提升、成本管控、品质改善、报告处理 6.新进人员培训 任职资格： 1、掌握Cu pillar bumping 相关应用与知识 2、精通8寸&12寸从plating/etching/ball mount/reflow段工艺、材料和设备技能
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