Application Director (Advanced Semiconductor Packaging)

The role

• Reports to the BU General Manager
• Lead applications, process integration, field service and on-site customer engineers
• Turn customer process needs (die size, pad pitch, overlay, throughput, cleanliness) into tool specifications
• Define test vehicles, alignment-mark requirements and acceptance criteria with customers and Engineering
• Run customer demos and evaluations; diagnose overlay, die shift, void and bond-strength issues
• Advise customers on mark design, layout and process changes that improve alignment and bond yield
• Integrate the bonder with upstream and downstream steps: CMP, clean, plasma activation, anneal and metrology
• Lead tool install and site acceptance; track uptime, MTBF and overlay stability, and feed field data back to Engineering and Quality
• Build field service processes: install, escalation, spares and training
• Support Sales with technical selling, benchmarks and roadmap input

What you bring

• MS or PhD in materials science, chemical, electrical, mechanical or optical engineering, or physics
• 12+ years in semiconductor equipment applications, process or field engineering, including 5+ years leading customer-facing teams
• Hands-on advanced packaging experience: hybrid bonding, D2W or W2W, TCB or flip-chip
• Process-level command of overlay data and alignment-mark performance
• Led new-tool install and acceptance at a fab or OSAT
• Strong in DOE, SPC, gauge R&R, and defect and yield analysis
• Able to engage customer engineering leadership credibly

Good to have

• Relationships with advanced packaging teams at foundries, IDMs or OSATs
• Experience building a field service organisation from scratch
• Familiarity with SEMI S2/S8 and fab facility requirements

How To Apply:

Interested candidate, please submit your updated resume in MS WORD Format to Terry Ng, email – [email protected]

EA Personnel Reg. No. R1107654, Achieve Career Consultant Pte Ltd EA Licence No. 05C3451

We regret that only shortlisted candidates will be notified. Thank you for your interest in this opportunity.