Application Engineer (Semiconductor Equipment / East Area)

Responsibilities

• Support customers in process development and application optimization.
• Conduct in-house application testing, cutting trials, and product evaluations.
• Provide on-site technical support and troubleshooting for customers.
• Investigate, manage, and resolve customer claims related to abrasive products.
• Collaborate closely with engineering teams in Japan on technical matters and application improvements.
• Build and maintain strong customer relationships through effective technical support.
• Foster positive collaboration across departments to ensure smooth project execution.
• Perform additional duties and projects as assigned.

Requirements

• 1 year of relevant working experience, preferably within the semiconductor industry.
• Experience or knowledge of dicing, grinding, or laser processing equipment.
• Knowledge of blade, grinding wheel, or laser-related technical support.

We regret that only shortlisted candidates will be notified. However, all applications will be updated to our resume bank for future opportunities.

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EA Personnel Name: Saito Ryuya
EA Personnel Reg. no.: R23116168
EA License no.: 07C5771

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