Application Engineer (Southern Region)

Our client is a specialised technology company serving the global semiconductor industry, focusing on precision tooling solutions for semiconductor assembly and packaging. They are looking for an Application Engineer with experience in wire bonding or ball bonding to support customer applications and the development of semiconductor bonding solutions.

Key Responsibilities

• Provide technical and application support for semiconductor bonding processes at customer sites and remotely.
• Troubleshoot wire bonding and related process issues, recommending appropriate tooling and process adjustments to improve yield, quality and reliability.
• Support bonding trials, tooling evaluations, customer qualifications and production ramp-ups.
• Analyse bonding performance, investigate defects and conduct root cause analysis to drive continuous improvement.
• Collaborate with customers' process, manufacturing and quality teams to resolve technical challenges.
• Work with internal R&D, manufacturing and product teams on application development, product evaluation and new product introductions (NPI).
• Prepare technical reports, document evaluation results and recommend product or process improvements.
• Provide technical discussions, demonstrations and training to customers as required.

Requirements

• Bachelor's Degree in Mechanical Engineering, Materials Engineering, Electrical/Electronics Engineering, Physics or a related discipline.
• Approximately 3–5 years of experience in semiconductor assembly, packaging or related manufacturing processes.
• Hands-on experience in wire bonding or ball bonding, particularly in process setup, parameter optimisation, process troubleshooting or bonding quality improvement.
• Good understanding of semiconductor bonding processes and common bonding defects.
• Experience in process qualification, failure analysis, yield improvement or NPI is an advantage.
• Candidates from semiconductor manufacturers, OSATs or bonding equipment suppliers are welcome, provided they have practical bonding-process experience.
• Strong analytical, problem-solving and communication skills.
• Comfortable working directly with customers and collaborating with cross-functional teams.
• Willing to travel domestically and internationally.