Assembly Back End Engineer 封装后端工程师（Base MLK)(J10237)

该职位来源于猎聘 职责描述：

• Back End Process Development；
• Quality Assurance；
• Process Documentation；
• Cross-Functional Collaboration；
• Continuous Improvement. 任职要求：
• Education: Bachelor's degree in Electrical Engineering
• Experience:

2.1 3+ years of experience in semiconductor back-end assembly processes.

2.2 Hands-on experience with reflow , laser mark and singulation.

• Soft Skills/others:

3.1 Able to communicate in English, Malay and Mandarin.