日月新半导体有限公司
Assembly Die Attach Engineer DB工程师(Base MLK)(J10238)
Skills
3 months ago
Share this opportunity
Share this opportunity to other talents of your network:
✓ Offer them a visibility boost with clients.
✓ Help your contacts find their next job.
Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
8 August 2026
What they need
该职位来源于猎聘 职责描述:
- Die Attach Process Development;
- Quality Assurance;
- Process Documentation;
- Cross-Functional Collaboration;
- Continuous Improvement. 任职要求:
- Education:*Bachelor;s degree in Electrical Engineering, Mechanical Engineering, Materials Science.
- Experience:
2.1 3+ years of experience in semiconductor assembly, specifically in die attach processes.
2.2 Hands-on experience with die attach equipment and tools.
- Soft Skills/others:
3.1 Able to communicate in English, Malay and Mandarin.
Other offers great for you!
These companies are also looking for great profiles
LeHibou
SailPoint Engineer
750€ / jour
Freelance
Paris, France
Hybrid
Skills
19 hours ago
Quick apply
Mobiskill
AI Engineer
500
Freelance
Paris, France
Hybrid
Top Recruiter
Skills
15 hours ago
Quick apply
skiils
Analytics Engineer / BI Engineer
500
Freelance
Paris, France
Hybrid
Skills
13 hours ago
Quick apply
No company information available.