Associate Engineer, Process

Position Summary

The

Process Associate Engineer

will be responsible to support the organisation’s Product Development and New Product Introduction activities reliably and efficiently. Candidates with related experience in Semiconductor and LCD processes are encouraged to apply for this position.

Responsibilities

Assist Engineers in:
Process recipe setup and qualification for production

Process monitoring and improvement.

Troubleshoot process-related issue.

Perform lots on hold and disposition

Engineering data collection

Other ad-hoc activities.

Support production line by:
Ensuring that process integrity for machines is in place for production.

Maintaining good housekeeping in the production area,

Co-ordinating with line operators/supervisors to ensure that work is carried out efficiently to meet module objectives and that SOPs are strictly followed.

Requirements

Diploma in Electrical/ Electronics/ Mechatronics/Mechanical/ Microelectronics Engineering or similar disciplines

No work experience required; training will be provided

Prior experience in the following areas in a semiconductor manufacturing environment would be advantageous:

Die preparation/ recon (backgrind, dicing, laser-grooving, pick and place, molding) processes

PVD (sputtering), chemical wet etching/ cleaning, lithography processes

Backend (ball mounting, ball drop, reflow, laser marking, package sawing, TnR) processes

Prior experience in manufacturing documentation of SPC, WI,SOP, FMEA, etc would be advantageous

Able to work under various shift patterns. Selected candidates will start with normal office hours, and eventually transition to 12-hour shifts

Silicon Box Pte Ltd is one of Asia’s fastest growing technology unicorn, at the forefront of semiconductors integration, emerging from the new horizon of Chiplets integration trends in the semiconductor industry, driven by the needs of "dis-integration", benefits of faster time-to-market and lower cost of new device design.

We provide services of semiconductor design of Chiplets at the leading edge of semiconductor device integration scheme with the next generation of advanced packaging manufacturing technologies.