Associate Engineer, Process (Die Prep/ Recon/ Pick and Place/ Backend)

Position Summary

The Process Associate Engineer is responsible to support the engineering activities as well as the daily production activities reliably and efficiently.

Candidates with related experience in Semiconductor and LCD processes are encouraged to apply for this position.

Responsibilities

• Ensure process integrity for machines related to production
• Monitor process via SPC chart/real time monitoring system
• Work on continuous improvement projects
• Perform lots on hold and disposition
• Support in recipe setup and qualification for production
• Troubleshoot process-related issue
• Collect engineering data
• Prepare manufacturing documents
• Maintain good housekeeping in the production area
• Any other ad-hoc duties as assigned by reporting supervisor

Requirements

• Minimum Diploma in Electrical / Electronics / Mechatronics / Mechanical/ Microelectronics Engineering or similar disciplines
• At least 3 years of process experience in any of the below: Die Prep processes (Backgrind, dicing, laser-grooving), Backend proceses (Pick and Place, SMT/SMD, Ball mounting, Reflow, Laser Marking and Package Sawing) and Packing (TnR, Tray, MBB, etc)
• Experience working in semiconductor manufacturing environment
• Experience in manufacturing documentation of SPC, WI, SOP, FMEA, etc.
• Able to work under various shift pattern. The selected candidate will start with normal office hours, and eventually transition to 12-hour rotating shift between day and night