Associate Engineer – Wire Bond Equipment

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

We are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

Key responsibilities

Perform machine setup, qualification, and conversion for wire bond equipment.

Troubleshoot and repair equipment-related issues to minimize production downtime.

Conduct preventive and corrective maintenance activities.

Monitor equipment performance and implement improvement actions.

Support production during machine breakdowns and urgent technical issues.

Perform root cause analysis and corrective actions.

Maintain equipment documentation and spare parts records.

What we're looking for

Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field.

Minimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting.

Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.

Strong troubleshooting and problem-solving skills.

Knowledge of semiconductor backend assembly processes is an advantage.

Able to support 12-hour rotating shifts.

Willing to work both Day Shift and Night Shift based on operational requirements.

Join a leader in the industry!

STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.

Join us and expand your world.