Associate Equipment Engineer

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

We are looking for an Associate Equipment Engineer to improve equipment performance, yield and quality while minimizing downtime, maximizing OEE and reducing manufacturing costs.

Key responsibilities

Perform line sustaining job function on set-up, conversion and equipment repair to support production loading.

Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts.

Communicate with external vendors to resolve problems.

Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost.

Support Backend Operation Balldrop, Ballrepair, Reflow Oven ,SRD Cleaning , Prober Tester , AOI Inspection .

What we're looking for

Diploma in Mechanical Engineering or equivalent.

Minimum 2 years of relevant experience in wafer bumping operations.

Ability to work on 12 hours rotating shift if required.

Willingness to learn and improve equipment knowledge and machine design through machine modification.

Join a leader in the industry!

STATS ChipPAC, a member of the JCET Group, is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services encompassing semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to customers around the world. Ranked as the third largest Outsourced Semiconductor Assembly and Test (OSAT) company, opportunities abound in growth and development as we continue to push towards new heights in this highly competitive field. Our comprehensive portfolio covers a wide spectrum of semiconductor applications servicing the telecommunications, consumer, automotive and other industries through advanced wafer level packaging, 2.5D/3D, System-in-Packaging, and reliable flip chip and wire bonding technologies. Our global footprint spans over 2 top-notched R&D facilities and 6 manufacturing locations in the Asia Pacific region, with global sales outreach as our sales network provide close technology collaboration and efficient supply-chain manufacturing to our global customers.

Join us and expand your world.