Automatic Die Attach Operator

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Automatic Die Attach Operator Job Description This role will be an assembly operator working with Automatic die attach equipment.

Responsibilities:

• Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
• Operate and set-up Automatic epoxy dispensing die attach machines (Datacon 2200 systems) per micro-circuit layout drawing.
• Involves working to microcircuit layout drawings; Operator is responsible for proper conductive epoxy dispense and die placement.
• Flexibility to be trained in multiple Microelectronics processes that involve die attaching.
• Requires significant attention to detail for production activities and documentation to maintain compliance with Mil Standard 883 requirements.

Experience and Education:

• Ability to set-up, operate and adjust (Plaomar 8000 or H+K 820 systems) or ability to learn to run a variety of microelectronic production equipment.
• Minimum of 2 years' experience in microelectronics module assembly area.
• High School diploma required.

Knowledge and Skill Requirements:

• Wire-bonding one Mil gold (Au) wire to a variety of dice and substrates.

Physical Environment and Working Conditions:

• Clean-room environment with Smocks and gloves.

EEO: MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation: MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process, please call +1-978-656-2500 or email HR_[email protected]. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.

ITAR Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Benefits: This position offers a comprehensive benefits package including but not limited to:

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.