MediaTek
Automotive Packaging Engineer/Technical Manager
3 months ago
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Important information
Contract type:
Permanent
Location:
Hsinchu, North District, Hsinchu City, Taiwan
Work mode:
Onsite
Published on:
7 August 2026
What they need
- Automotive Packaging development, New product introduction, Mass production, Supplier management. 2. Develop and evaluate the advanced IC Package technology. 3. Collaborate with the assembly subcontractors to complete the technology development. 4. Qualification and yield improvement for the advanced IC Packages. 5. Audit subcontractors.
Main Requirements and Qualifications
- MS degree (or above) in Science or Engineering.
- In depth understanding of IC package cost structure, manufacturing, material, process.
- Familiar/experienced with advance IC package development, especially in bumping/Fan-out/WLCSP/2.5D/3D related packages.
- Understanding of different kinds of package structures, such as PBGA/TFBGA/FlipChip/POP/PiP/SiP/Module/InFO.
- Familiar with TO flow, OSAT management, Automotive quality/reliability requirement.
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