先进封装研发副理(bumping)(J10446)

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先进封装研发副理(bumping)(J10446)

日月新半导体有限公司

先进封装研发副理(bumping)(J10446)

2 months ago

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Important information

Contract type:

Permanent

Location:

Suzhou, Jiangsu, China

Work mode:

Onsite

Published on:

12 August 2026

What they need

该职位来源于猎聘职责描述： 1.对先进封,如Fan out/InFO/CoWoS/CoPoS/Glass core/TGV制程整合规划

熟悉BD/POD design
Assembly PID setup and check
研发专案的开展及追踪
研发完成导入量产
完成主管交代事项

任职要求： 1、5年以上熟悉CoWoS/CPO/Fan out/Bumping全流程，并主导完成相关专案（具备其一即可） 2、5年以上photo/sputter 制程经验（具备其一即可） 3、具备基本英文沟通能力，能直接与国外客户进行技术交流

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