日月新半导体有限公司
先进封装Bumping工程总监(J10641)
1 month ago
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Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
28 September 2026
What they need
该职位来源于猎聘 职责描述： 1.新客戶、新產品導入及量產 2.新材料評估導入及量產 3.新設備評估導入及量產 4.新工藝流程開發 5.在線異常產品處理技術支持 6.其它指派的日常工作執行與改善 任职要求： 1.精通半導體bumping/Assy Process 2.瞭解 SPC 知識 3.瞭解 QC七大手法 4.掌握成本分析與控制 5.瞭解 半導體bumping成本結構及投資回報核算方式 6.瞭解六大品質工具的使用（瞭解MSA,FMEA.CP等相關知識） 7.瞭解项目管理流程
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