Camera Engineer

**Position : Camera Engineer

Location : Sunnyvale, CA

Fulltime

Job Requirements:-** Key Qualifications

• Over 7 years of hands-on experience in semiconductor IC or module packaging,

especially on Camera Module or related processes.

• Process technology knowledge in SMT and advanced IC / camera module

packaging areas

• Knowledgeable in advanced process equipment such as Flip Chip, Die and Wire

Bonding, Molding, Wafer Dicing, Laser Singulation, Lens Holder / Active

Alignment Process & etc.

• Experienced working with subcontract manufacturing partners.
• High volume manufacturing, and production ramp experience.
• Knowledgeable in production control processes, machine commissioning, data

analysis/interpretation GR&R, Cp/Cpk and correlation analysis

• Fluent in English communication, additional language skills a plus.
• Demonstrated ability to perform DOE, data analysis, SPC control.
• Demonstrated failure mode analysis, root cause investigation, and problem

solving for product yield and quality issue.

• Project Management- Excellent data handling, documentation, critical milestone

creation, and organization skill

• Strong collaboration skill to work with diversified x-function team.

Description

• Develop Camera Module assembly process / equipment / materials for FOL

(Front of Line) and EOL (End of Line) - Develop new assembly process /

equipment / material for Camera module related components - Provide technical

leadership in resolving any process issues - Responsible for developing DOEs,

Statistical Process Analysis, Process Specification, D/PFMEA and Process

control plan - Responsible for Failure analysis, Corrective actions and Yield

improvement

• Process technology feasibility studies through theoretical simulation and/or

practical engineering methods Process Development - Leads design and

development of technically complex manufacturing processes including material

selection, parameter optimization, equipment, metrology, and system design to

enable new products designs & functional requirements.

• Develop Process for Manufacturability - Provide early and ongoing manufacturing

leadership to ensure new process is scalable for high volume Process FMEA -

Lead PFMEA generation for new process technology Failure Analysis - Lead root

cause analysis and metrology development for issues related to new process

technology.

• Supporting complex, high volume camera module modules. Provide leadership in

the areas of module construction, materials, equipment, and processes.

• Identify the correct product process flow, compatible with high volume

manufacturing requirements. Work to develop key and new

process/equipment/material for camera module. Participate in external vendor

assessment and selection, from MP intent equipment, process, to direct and

indirect materials. Responsible for DOE planning, statistical process analysis,

process specification, and D/PFMEA.

Education & Experience

B.S. degree in Engineering (Mechanical, Electronics, Electrical, Physics, or

equivalent)

Regards, Anil Kumar US IT Recruiter Contact Details: 609-755-5388 Email: - [email protected] 4365 Route 1 South, Suite 105 Princeton, NJ 08540 www.applabsystems.com