机械钻孔技术开发专家

该职位来源于猎聘 Responsibilities and Main Tasks:

• Technology Leadership
• Define and drive the CoWoP technical roadmap and future manufacturing capability.
• Evaluate equipment, materials, processes for plant readiness.
• Act as technical authority for high‑end customers.
• Process Development
• Lead development of multi‑layer (20–30+ layer) high‑speed PCB structures.
• Solve challenges: alignment, back‑drill depth, plating uniformity, warpage, fine-line integration.
• Define SI/PI-driven process tolerances.
• Quality & Reliability
• Establish CoWoP‑specific process windows, DOE studies, and reliability standards.
• Develop new test methods for OAM/CoWoP products.
• Cross‑Plant Collaboration
• Work closely with SHA, and CHQ2 plant teams to ensure technical alignment.
• Lead technical knowledge transfer. Requirement：
• Bachelor’s degree or higher in Electronic Materials, Microelectronics, Electrical Engineering, Mechanical Engineering, or a related field. 2. 8+ years of experience in PCB process engineering or technology development, with at least 5 years focused on PCBs for data center/server/high-end communication equipment.
• Experience in OAM / CoWoP / HLC server boards as a plus: Must have a proven track record in the mass production of 20+ layer PCBs, with in-depth knowledge and practical solutions for the challenges of 30+ layer boards
• Expert in High-Speed Materials: Thorough understanding of various high-speed/low- and ultra low-loss materials, their properties, processing requirements, and impact on reliability.
• Experience in miniaturization (SOP, mSAP, embedded materials) if relevant
• Deep SI/PI Understanding: Ability to interpret SI simulation reports and translate electrical performance requirements (e.g., impedance tolerance ±8%, insertion loss) into precise process control parameters.
• Familiarity with Nvidia, AMD, or Broadcom supply chain is highly attractive.
• Excellent analytical skills for complex problem-solving and a strong foundation in Design of Experiments (DOE). Once a resume is submitted to the recruiting company, it is considered that the applicant agrees to the collection, processing, use, and disclosure of their resume and other personal information by the recruiting company for recruitment purposes. 一旦向招聘公司投递简历，即视为应聘者同意招聘公司基于招聘目的而对其简历和其他个人信息进行收集、处理、使用和披露等。