树脂塞孔专家

该职位来源于猎聘 Your Responsibilities

• Manage supplier to enable the technology development and HVM readiness
• Coordination with Core supplier and internal TD team to organize project team and follow up with work details.
• Follow up the plan of stepwise, IWV, IEV for new platform TV
• Cowork with supplier to improve IPP/KPP/Yield
• Support any investigation related to Core issue ; Integrate with TD engineer, Quality engineer and operations team during investigation
• Manage Core supplier capex including qualification lot run at ICS line
• Process validation lots at CHQ and issue the change notice control to Customer
• Support HVM readiness
• Support project and activities for new Core supplier qualification
• Follow AT&S information security policy to prevent core data leak outside. Follow RBA requirement Your Profile
• Experience in related industry advantageous including PCB and substrate for ＞ 5 years
• Good Written and Oral English.
• Have work experience in PCB or substrate industry.
• Good communication skills with core supplier and customer. Can independently communicate with customers.
• Team spirit (able to be team leader and be a team member as well)
• Understand and able to review FMEA ,Control Plan, and other quality related documents.
• Has a good problem solving skills and ability to use AT&S model based problem solving (MBPS) methodology.
• Good stress management skills.
• Good analytical skills with meticulous attention to detail
• Ability to generate change control documents (PPCR, WP etc) is an advantage.
• Basic knowledge of quality standards (ISO/ IATF16949)
• Familiar with quality tools like APQP ,SPC, MSA, FMEA, PPAP… Once a resume is submitted to the recruiting company, it is considered that the applicant agrees to the collection, processing, use, and disclosure of their resume and other personal information by the recruiting company for recruitment purposes.