激光钻孔技术开发专家

该职位来源于猎聘 Responsibilities and Main Tasks:

• Develop and drive the company's technical strategy and process roadmap for COWOP, includes machine & process(method, material,chemical…) investment
• Lead the process development for multi-layer core & 30+ layer ultra-high-layer-count PCBs, solving critical manufacturing challenges such as lamination alignment, depth control for back-drilling, plating uniformity with high aspect-ratio through-holes., fine-line solution, Impedence control, stack-up warpage/coplanarity solution, reliability enhancement...etc.
• Establish and refine specialized processes, quality control standards, and test methods, elevating the overall technical competency of the team.
• Serve as the company's ultimate technical authority in key customer engagements, addressing complex challenges in state-of-the-art product designs. Requirement：
• Bachelor’s degree or higher in Electronic Materials, Microelectronics, Electrical Engineering, Mechanical Engineering, or a related field. 2. 8+ years of experience in PCB process engineering or technology development, with at least 5 years focused on PCBs for data center/server/high-end communication equipment.
• Expert in High-Layer-Count PCBs: Must have a proven track record in the mass production of 20+ layer PCBs, with in-depth knowledge and practical solutions for the challenges of 30+ layer boards
• Expert in High-Speed Materials: Thorough understanding of various high-speed/low- and ultra low-loss materials, their properties, processing requirements, and impact on reliability.
• Deep SI/PI Understanding: Ability to interpret SI simulation reports and translate electrical performance requirements (e.g., impedance tolerance ±8%, insertion loss) into precise process control parameters.
• Experience working in Nvidia supplier chain is a plus
• Excellent analytical skills for complex problem-solving and a strong foundation in Design of Experiments (DOE).

Once a resume is submitted to the recruiting company, it is considered that the applicant agrees to the collection, processing, use, and disclosure of their resume and other personal information by the recruiting company for recruitment purposes. 一旦向招聘公司投递简历，即视为应聘者同意招聘公司基于招聘目的而对其简历和其他个人信息进行收集、处理、使用和披露等。