封装研发资深工程师

该职位来源于猎聘 About the role The Principal Engineer of Package Architect is responsible to identify new type of packages, platforms, materials, processes, equipment and concepts for Nexperia grown. Besides that, you will be: Responsible to work out and provide development proposals, which are solid and can be accepted for developments and introduction. Responsible to develop subcontractor relationships, to create access to technologies, tools and materials via partnerships and actively building and maintaining a network of relevant experts. Accountable to collect technical market requirements, customer needs, technology scouting and benchmarking information to analyze technology and application trends and to derive innovative solutions. Responsible to provide input for the package roadmap. Responsible to introduce new packaging and release at subcontractor Responsible to build on Nexperia competitive level of competence by spreading his/her know-how, and responsible to provide mentorship to less experienced engineers in his/her technical domain. What you will need Broad knowledge in Semiconductor Package development, good at advance packaging, Power packaging. Broad knowledge in general physics, materials, and processes. Solves complex and new problems and able to master new technology. Energetic and result driven, technical Leader with ambition to grow. Strong skills in architectural thinking, critical judgement and fast and structured problem solving. Very good communicator, high ability for networking external and internal.