烟台德邦科技有限公司
芯片底填胶黏剂研发工程师
2 months ago
Share this opportunity
Share this opportunity to other talents of your network:
✓ Offer them a visibility boost with clients.
✓ Help your contacts find their next job.
Important information
Contract type:
Permanent
Location:
Suzhou, Jiangsu, China
Work mode:
Onsite
Published on:
14 August 2026
What they need
该职位来源于猎聘 职责描述： 主要负责muf 或 cuf 或 LMC研发经验 任职要求： 具有底部填充材料开发经验（芯片级底部填充材料开发经验者优先考虑），本科学历有相关行业研发背景可放宽
Other offers great for you!
These companies are also looking for great profiles
N
Ness Technologies
RSO (Responsable sécurité opérationnelle)
60000
Permanent contract
92120 Montrouge, France
Onsite
Skills
GDPR
10 hours ago
Quick apply
C
Celad
Responsable déploiement PMO Programme Confirmé (H/F)
40000/48000€
Permanent contract
Rennes, France
Onsite
Skills
Responsable déploiement PMO
5 hours ago
Quick apply
H
Hepta Advisory Labs
Développeur C# / .NET 6+ – Trading Électronique / Front Office
Freelance
Paris, France
Onsite
Skills
C#.NETNET 6
5 hours ago
Quick apply
No company information available.