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硬件经理

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硬件经理

捷普科技(上海)有限公司

硬件经理

2 months ago

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Important information


Contract type:

Permanent

Location:

Hangzhou, Zhejiang, China

Work mode:

Onsite

Published on:

16 August 2026

What they need


该职位来源于猎聘 岗位职责

1、负责芯片硬件架构设计及关键模块方案制定,参与并推动芯片整体技术方案落地 2、深度参与 SoC 硬件设计、验证与问题定位,支持芯片从设计到流片及量产全过程 3、负责 FPGA 原型系统设计与验证,用于 SoC 功能验证和性能评估 4、负责开发板硬件设计,完成 FPGA / SoC Demo 的实现与调试 5、为芯片生产、测试及客户应用提供技术支持,协助解决量产及应用中的关键问题 6、参与跨部门技术协作(软件、系统、验证、生产等),推动项目高质量交付 7、对硬件技术路线、关键技术选型提供专业建议,承担核心技术攻关任务 任职要求 1、计算机体系架构,微电子,电子,通信或等相关专业博士学位并有一定工作经验(至少5年)或计算机体系架构,微电子,电子,通信或等相关专业硕士学位并有较长工作经验(至少15年); 2、有芯片项目领导经验;

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