成都泰美克晶体技术有限公司
工艺工程师（清洗、磨抛、切割）
2 months ago
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Important information
Contract type:
Permanent
Location:
Chengdu, Sichuan, China
Work mode:
Onsite
Published on:
22 August 2026
What they need
该职位来源于猎聘 1、为现场作业人员提供技术支持，快速处理生产工艺异常，指导团队攻克复杂工艺难题，保障生产流程稳定。 2、编制优化标准化作业 SOP，统一工艺执行标准；熟练操作维护研磨、抛光、切割、CNC 及清洗设备，按需调试参数，参与设备选型并给出合理化建议。 3、建立并完善工艺质量管控体系，监督标准执行；分析生产数据、排查隐患并落实预防改善措施，降低产品不良率。 4、开展质量问题根因分析与专项改善，负责新产品工艺验证及量产导入 技能要求： 1.切割：熟悉金刚线、砂浆线，激光切割、划切机 2.磨抛：熟悉宇晶、森永、化学腐蚀抛光（CMP) 3.清洗：熟悉自动和半自动清洗机、洗过半导体或者光学产品微小产品，光洁度要求较高的，有除胶除蜡的经验
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