高级封装工程师

该职位来源于猎聘

• Lead Packaging Design & Development: Drive end-to-end packaging design, development, and introduction for new sensor ICs and integrated module products. Evaluate the feasibility of various packaging solutions, encompassing both sensor ICs and integrated modules.
• Expert Simulation & Analysis: Serve as the primary expert for advanced thermal, mechanical stress, and multi-physics simulations related to both IC and module packaging. Use simulation results to optimize designs for thermal dissipation and structural integrity, guide material selection, and validate models against experimental data.
• Vendor Collaboration & Technical Leadership: Partner closely with external packaging and substrate manufacturers. Provide technical guidance to ensure design manufacturability, process adherence, and quality standards. Drive continuous process optimization and yield improvements with manufacturing partners.
• Project Coordination & Contribution: Contribute to overall project success by coordinating packaging-related activities, managing specific schedules and deliverables, and supporting cost analysis, ensuring alignment with overarching project goals and timelines in collaboration with internal stakeholders.
• Problem Resolution: Provide expert technical support to resolve packaging anomalies during trial runs and mass production. Proactively identify and solve complex technical packaging issues.
• Reliability & Documentation: Support comprehensive packaging reliability verification and analysis for both ICs and modules. Develop and maintain technical standard documents and reports. 职位要求：
• Education: Bachelor's degree or higher in Physics, Mechanical Engineering, Materials Science, Microelectronics, or a related field.
• Industry Experience: o Deep understanding and hands-on experience with sensor IC packaging processes and manufacturing. o Experience/familiarity with traditional packaging forms (DFN, QFN, SOP, SOIC). o Direct experience working in an Integrated Circuit (IC) packaging company is preferred. o Experience with module-level packaging concepts is highly valued.
• Technical Skills: Expert proficiency in advanced finite element analysis (FEA) software for thermal, mechanical stress, and multi-physics simulations (e.g., Ansys, COMSOL). Proficient in AutoCAD or similar CAD tools.
• Professional Attributes: Excellent written and verbal English communication skills. Strong organizational, coordination, and collaboration skills, especially with external vendors and internal teams. Results-oriented with a strong quality consciousness and sense of responsibility.