同有科技
硬件开发应届生
2 months ago
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Important information
Contract type:
Permanent
Location:
Changsha, Hunan, China
Work mode:
Onsite
Published on:
27 August 2026
What they need
该职位来源于猎聘 请注意:目前岗位暂时只招聘2027年应届生
岗位职责: 1、 负责产品硬件设计、硬件方案编写、元器件选型、原理图设计及PCB评审工作; 2、 负责硬件产品各个阶段的调试工作,与结构、软件等工程师协作,共同解决产品在各个阶段的设计问题; 3、 设计开发包括模块、子系统设计、详细设计、测试、调试等工作。 任职要求: 1、硕士及以上学历,电子信息、自动化等相关专业; 2、对硬件岗位有较强深耕发展意愿,学习能力、沟通能力强; 3、有硬件开发经验或项目经历优先。
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