哈工大机器人(合肥)国际创新研究院
高级硬件工程师
Skills
2 months ago
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Important information
Contract type:
Permanent
Location:
Shenzhen, Guangdong Province, China
Work mode:
Onsite
Published on:
28 August 2026
What they need
该职位来源于猎聘 岗位职责: 1、负责医疗产品硬件单板开发和调试工作; 2、熟悉模拟,数字等混合电路的设计与开发,如OP,ADC,DAC,PLL,ARM/FPGA/SOC/工控板或AI模组等; 3、具备较强的硬件系统设计经验和全局观,精通SI/PI/EMC/ESD等设计实现; 4、良好的沟通能力,思维发散能力及能动性; 5、有医疗彩超硬件开发经验优先。 任职条件:本科及以上学历,电子类/机械电子类专业,工作经验8年以上。
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