封装工程师（项目管理）

该职位来源于猎聘 Description：

• APO Process Integration & Development
• Design and integrate end-to-end process flows for APO, including epitaxy, lithography, etching, deposition, cleaving, polishing, and advanced packaging (e.g., silicon photonics, heterogeneous integration)
• Collaborate with R&D on design-for-manufacturability (DFM) reviews for new APO products, supporting tape-outs (NTO), process flow establishment, and prototyping .
• Lead process characterization, DOE execution, and parameter optimization to achieve target optical and electrical performance metrics .
• New Product Introduction & Yield Ramp
• Drive new product introductions (NPI) from pilot to mass production, developing specifications (e.g., Process Roadmap, TCP), control plans, and standard operating procedures (SOPs) .
• Resolve process anomalies and low-yield issues by analyzing inline parametric data, WAT/CP test results, and failure analysis reports .
• Optimize process stability and capacity ramp-up to meet quality and reliability standards for high-volume manufacturing .
• Cross-Functional Coordination
• Work with module engineers (Photo, Etch, Thin Films), quality assurance, and equipment teams to align process modules and address integration challenges .
• Interface with optical and electrical design teams to define process requirements, validate technology transfers, and ensure successful product qualification (e.g., reliability testing, ESD improvement) .
• Continuous Improvement & Documentation
• Apply Lean Manufacturing and Six Sigma methodologies to reduce cycle time, improve process capability (CPK), and lower production costs .
• Create and maintain comprehensive technical documentation, including process flow maps, BOMs, FMEA, and qualification reports .

Qualifications And Skills

• Education & Experience
• Master’s or PhD in Optics, Photonics, Microelectronics, Electrical Engineering, Materials Science, or a related field .
• 5+ years of experience in process integration/engineering roles, with a focus on photonics, CPO, or high-speed optical modules. Experience in a semiconductor fab environment is required .
• Technical Skills
• Deep knowledge of photonics chip process flows: epitaxy, lithography, dry/wet etch, dielectric/metal deposition, cleaving, and polishing .
• Proficiency in using data analysis tools (JMP, Spotfire), CAD software, and statistical process control (SPC) for yield improvement .
• Familiarity with photonic device simulation (e.g., Lumerical, Zemax) and experience in technology transfer or qualification processes is highly desirable .
• Professional Competencies
• Strong analytical and problem-solving skills to address complex integration issues and drive root-cause analysis .
• Excellent communication and project management skills, with the ability to lead cross-functional teams and present technical updates to stakeholders .
• Self-motivated, innovative, and adaptable to dynamic project milestones in advanced packaging development .