封装工程师

该职位来源于猎聘 Job Description

• FOL Photonics Process Development & Integration
• Design, develop, and optimize front-end wafer-level processes for silicon photonics (SiPh) or other PIC platforms, including but not limited to lithography, etching (dry/wet), thin-film deposition (dielectric/metallic), and wafer cleaning .
• Lead the integration of these FOL processes to build functional optical devices (e.g., modulators, detectors) and ensure compatibility with subsequent back-end-of-line (BOL) packaging steps like flip-chip bonding and fiber attachment .
• Collaborate with photonics designers on Design for Manufacturability (DFM) to ensure new APO product designs are optimized for process capability and high yield .
• New Process Technology & Product Introduction
• Drive the introduction of new FOL process technologies and materials from R&D into a high-volume manufacturing environment .
• Create detailed process specifications, control plans, and standard operating procedures (SOPs) for FOL optical processes
• Conduct process characterization, Design of Experiments (DOE), and statistical analysis to define optimal process windows and improve yield .
• Process Stability, Sustaining, and Yield Enhancement
• Monitor process stability and performance using Statistical Process Control (SPC) methodologies
• Lead troubleshooting efforts for FOL process excursions, defect reduction, and inline parametric deviations .
• Perform root-cause analysis (RCA) and failure analysis (FA) for optical performance issues stemming from FOL steps, utilizing tools such as SEM and other metrology equipment .
• Implement continuous improvement initiatives using Lean Six Sigma principles to reduce cycle time, lower costs, and enhance process capability (CPK) .
• Cross-Functional Collaboration & Technical Leadership
• Work closely with integration, device, and yield enhancement teams to resolve complex integration issues
• Interface with back-end packaging and test teams to ensure a seamless transition from wafer fabrication to final APO module assembly .
• Provide technical mentorship to junior engineers and serve as the FOL process expert
• Evaluate and qualify new fabrication equipment and materials in collaboration with suppliers .

Qualifications

• Education & Experience
• Master's or PhD in Optical Engineering, Photonics, Semiconductor Physics, Electrical Engineering, Materials Science, or a closely related field .
• A minimum of 8+ years of hands-on experience in process engineering, with a significant focus on front-end semiconductor or photonics wafer fabrication processes
• Experience in a high-volume manufacturing (HVM) environment, such as a foundry or IDM, is highly desirable .
• Technical Expertise
• Deep FOL Process Knowledge: Proven expertise in multiple wafer-level processes such as advanced lithography, plasma etching, PVD/CVD deposition, and metrology
• Experience with silicon photonics fabrication is a strong plus .
• CPO Technology Understanding: Strong understanding of CPO architecture, including its drivers (power efficiency, signal integrity) and associated challenges (thermal management, co-simulation) .
• Analytical & Software Skills: Proficiency in data analysis tools (JMP, Minitab), statistical methods (SPC, DOE), and simulation software (e.g., COMSOL, ANSYS, optical simulators like Lumerical) is highly valued
• Familiarity with CAD software is beneficial
• Professional Competencies
• Excellent analytical and problem-solving skills with a demonstrated ability to tackle complex process integration challenges .
• Strong project management and communication skills, with the ability to lead technical discussions and collaborate effectively with cross-functional and global teams .
• Fluency in English is typically required for global collaboration .