北京理工大学重庆创新中心
硬件工程师实习生
2 months ago
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Important information
Contract type:
Permanent
Location:
Chongqing, China
Work mode:
Onsite
Published on:
3 September 2026
What they need
该职位来源于猎聘 1.负责硬件系统的设计与测试,包括传感器、通信与数据处理,输出相关设计文档; 2.完成功能电路的原理图和PCB设计、BOM表设计与制作; 3.负责单板与整机系统的联调联试,输出相关测试文档; 4.配合软件工程师进行功能和性能调试及改进; 5.参与项目交付与维护; 任职要求: 1. 本科、硕士在校生,每周至少保证3天在岗,电子、通信、自动化相关专业; 2.熟练使用AD软件进行原理图和PCB设计; 3.熟悉BOM文件设计与制作流程规范; 4.具有团队合作精神、良好的沟通协调能力和高度的责任心;
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