产品工程师-半导体设备

该职位来源于猎聘 此职位为无锡闻讯半导体设备有限公司职位 无锡闻讯半导体设备有限公司 无锡闻讯半导体设备有限公司是一家专注于半导体先进封装设备的高新技术企业，公司总部位于江苏无锡，依托长三角半导体产业集群实现高效运营。 公司拥有 DBDS XF 先进封装平台等旗舰产品，覆盖标准器件、倒装芯片、功率半导体等封装需求，性能指标行业领先。 公司隶属于闻泰集团，依托于安世中国，成员源自 ITEC 核心团队，继承二十余年技术积累，在高精度运动控制、智能视觉检测等领域建立了核心技术壁垒。 未来，公司将全力突破 Chiplet、3D堆叠等前沿设备，向整体解决方案提供商转型，深耕汽车电子、AI芯片等新兴市场，并与产业链上下游共建产业生态。 我们的愿景是成为全球领先的半导体先进封装设备整体解决方案提供商，以＂创新、卓越、客户至上、合作共赢＂为价值观，与客户共创产业价值。 加入我们，共赴半导体黄金赛道 在这里，您将与中国顶尖半导体设备团队并肩作战，参与前沿技术攻关，职业成长空间广阔。我们提供有竞争力的薪酬福利与开放平等的技术氛围，期待志同道合的您加入，一起引领行业变革！ 【工作内容】Job Description

• Responsible for the full-process of semiconductor back-end packaging equipment (die bonder, sorter) products from power-on initialization, module test, functional setup, IAT, and even FAT after the completion of machine assembly. 负责半导体后道封装设备固晶机、分选机产品设备在整机装配完成后从通电初始化、模块测试、功能设置、整机内部验收、直到客户验收全流程的工作。
• Customer Acceptance: Based on the product and process parameters provided by the customer, setup the machine to simulate production status, and cooperate with the project manager to complete the FAT. 客户验收：根据客户提供的产品和工艺参数，将设备调试到模拟生产状态，配合项目经理完成厂内客户验收。
• For functional failure, performance deviations, and other issues identified during setup, feedback and cooperate with the R&D to conduct Root Cause Analysis (RCA), track rectification and verification until closure. 对调试中发现的功能缺陷、性能偏差等问题，反馈并配合研发部进行根因分析（RCA），跟踪整改验证直至关闭。
• Draft the setup-related chapters in the ＂Machine Assembly Operation Instruction Manual,＂ provide technical guidance to external assembly workers on critical processes (such as grounding, shielding, and cable routing), and feedback issues such as structural interference, tolerance out-of-specification, and cable length encountered during the assembly process to the R&D department to drive design optimization. 编制《整机装配作业指导书》中调试相关章节，对外包装配工进行关键工序（如接地、屏蔽、线缆走向）的技术指导，将装配过程中的结构干涉、公差超差、线缆长度等问题反馈给研发部，推动设计优化。
• Participate in the formulation standards such as ＂Machine Commissioning Inspection Standards,＂ ＂Factory Acceptance Inspection Standards,＂ and ＂Test Report Templates,＂ and cooperate with the R&D department for new product development and verification. 参与制定/修订《整机调试检验规范》《出厂检验标准》《测试报告模板》等企业标准，配合研发部进行新产品的开发和验证。 职位要求： 【岗位要求】Position requirement
• College degree or above, majoring in Mechanical Engineering, Automation, Electrical Engineering, Measurement and Control Technology and Instrumentation, Mechatronics, or related fields. Background in semiconductor equipment, precision automation equipment, or SMT equipment are preferred 大专及以上学历，机械工程、自动化、电气工程、测控技术与仪器、机电一体化等相关专业，有半导体设备、精密自动化设备、SMT设备行业背景者优先。
• Over 5 years of experience in precision automation equipment setup, testing, and after-sales technical support. Experienced in semiconductor back-end packaging equipment such as die bonders, wire bonders, die attach machines are preferred. 5 年以上精密自动化设备调试、测试、售后技术支持经验，有固晶机、焊线机、贴片机等半导体后道封装设备调试经验者优先。
• Able to read mechanical assembly drawings and BOM, and understand tolerance, transmission mechanisms, vacuum/pneumatic principles. 能读懂机械装配图、BOM表，理解公差配合、传动机构、真空/气动原理。
• Able to read electrical schematics and wiring diagrams, familiar with the setup of servo motors, sensors, PLCs/motion controllers. 能读懂电气原理图、接线图，熟悉伺服电机、传感器、PLC/运动控制器的调试。
• Familiar with Office software such as Word, Excel, and PPT, Better to pass CET-4 or above, writing Chinese and English test reports with clear structure and detailed data. 熟悉Office软件如word, excel, PPT, 英语CET-4, 能独立撰写结构清晰、数据详实的中英文测试报告者尤佳
• Strong stress resistance, strong communication and coordination skills, logical analysis and learning abilities, accept a certain intensity of overtime work, and willing to travel domestically and internationally. 抗压能力强，沟通协调能力强，有一定的逻辑分析能力和学习能力，接受一定强度加班，接受国内外出差