小派科技(上海)有限责任公司
良率改善工程师
2 months ago
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Important information
Contract type:
Permanent
Location:
Chengdu, Sichuan, China
Work mode:
Onsite
Published on:
9 September 2026
What they need
该职位来源于猎聘 岗位职责: 1、具备半导体封装组装量产一线的实操经验。 2、负责良率损失监控、失效模式分类, 3、运用8D/FMEA/SPC/DOE进行根本原因分析,开展跨部门故障排查,部署纠正与预防措施(CAPA)。 4、推进新产品导入(NPI)良率爬坡。借助Minitab、MES/YMS进行数据分析与实验验证,推动所负责产品组合的良率提升、报废降低及制程能力改善。 岗位要求: 1、本科及以上学历,机械、电子、材料、微电子等理工类专业。 2、会数据处理,熟练使用良率分析软件。 3、逻辑分析强,跨部门共同能力强。 4、良好的英语读写能力。
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