长电集成电路（绍兴）有限公司
磨划研发工程师
1 month ago
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Important information
Contract type:
Permanent
Location:
Shaoxing, Zhejiang, China
Work mode:
Onsite
Published on:
12 September 2026
What they need
该职位来源于猎聘 岗位职责： 1.
负责新产品新结构磨划工序的技术开发 2.
负责对应站点新设备/新材料的评估验证和工艺开发，以及与对应设备及材料的厂商对接沟通 3.
负责新产品磨片、激光开槽、划片过程中数据收集及异常问题分析与解决 4.
新产品/新工艺开发过程中进行试验设计与实施、数据收集和报告整理 5.
项目实施进度定期汇报，以及按公司体系要求进行标准化和文件化等 任职资格： 1.本科及以上学历，理工科专业，有半导体封装3年及以上工作经验 2.熟悉磨片、划片、激光开槽、隐形切割工艺流程和相关知识，熟悉disco设备机台 3.有良好的沟通能力和团队合作精神，热爱本职工作，对磨划封装技术有浓厚的兴趣，具有较强的责任心和抗压能力 4.薪资面议
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